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Sputtering | Metallic materials are sputtered on substrates with a batch equipment and R to R equipment.

01Sputtering

スパッタリング装置

Sputtering machine

フィルム上への銅薄膜形成例

Example of sputtering
(Copper layer formation on film)

Features

・Thin metal layer is formed with a reel to reel sputtering machine.
・Sputtering of Copper, Ni-Cr alloy and Cr is available.
・Adhesion of sputtered layer is improved by plasma treatment of base material.

02Material scale for sputtering

Roll diameter max 350mm
Weight max 500kg
Material width max 1,100mm
Sputtered width max 1,000mm